huahana

HI'OHI'O nā hi'ohi'ona nui o ka 200 Series baseplates:  No ka FBM-supporting baseplates: • 2, 4, a me 8 modules positions in combination with vertical and horizontal mounting • Field connection for I/O hoopau assembles, redundant adapters and module identifiers for each module • DIP switch no ka ike ana i kekahi mau Modular Baseplates rei. (koi i ke kaʻa kaʻa ʻē aʻe)  Hoʻohui i ka 2 Mbps Module Fieldbus no nā Module Fieldbus maʻamau, a i ʻole he 268 Kbps Fieldbus no nā 100 Series FBMs  Nā mea hoʻokaʻawale/terminators no ka manawa strobe a me A/B Fieldbus  Hoʻohui no ke koho manawa strobe GPS no ke kākoʻo FCP2700, FCM2700. 24 V dc ka mana a me ke kula kiʻekiʻe  Hoʻopili i hope me nā subsystem I/O i kēia manawa e hiki ai ke hoʻonui i ka wā e hiki mai ana me ka ʻole o nā lako kikowaena hou  Nā kūlana kī i hoʻolaʻa ʻia no CP a i ʻole FCM/FBM wale nō, ma muli o ke ʻano baseplate  Passive backplane e hoʻonui i ka hilinaʻi o ka ʻōnaehana.